SoftBank Corp, Intel Partner on Low-Power AI Memory Chip Targeting 2028 Launch

SoftBank Corp (9984.T) and Intel (INTC-US) announced a partnership on February 3, 2026, to co-develop a new high-capacity, low-power memory technology targeting AI data centers. Their joint effort focuses on commercializing the "Z-Angle operation memory technology" architecture. SoftBank’s subsidiary Saimemory will integrate Intel’s next-generation DRAM bonding technology, aiming to deliver a prototype as early as early 2028. The initiative addresses soaring computational demands from generative AI models. The collaboration aligns with Intel’s broader strategy to strengthen its AI chip portfolio amid intense competition. SoftBank Group Corp, parent of SoftBank Corp, committed $2 billion to Intel in mid-2025.