Intel Unveils 78mm Thick Core Glass Substrate at NEPCON 2026, Enabling Next-Gen AI Packaging

Intel announced at NEPCON 2026 (February 5, 2026) a 78mm×77mm thick-core glass substrate integrating embedded multi-chip interconnect bridges (EMIB), advancing packaging to a glass-based era. The 20-layer stack supports a "10-2-10" vertical routing, enabling next-generation AI accelerators with 45-micron bump pitches and dual EMIB validation for multi-chip syneresis. Traditional organic substrates deform under high temperatures, causing interconnect failures as die sizes approach photolithography limits. The glass core, with a thermal expansion coefficient similar to silicon and a 0.8mm thickness, provides high rigidity and zero microcracks via the No SeWaRe process, supporting high-density I/O and billion-transistor AI packaging while addressing AI算力 demands.