Samsung Nears Nvidia HBM4 Certification for Next-Gen AI Chips

Samsung Electronics is in the final stages of securing certification from Nvidia for its next-generation HBM4 high-bandwidth memory, crucial for AI accelerators, according to a report on January 26, 2026. This approval would position Samsung to supply a key component for Nvidia's future AI graphics processing units, directly competing with SK Hynix. The certification process is reportedly in its last phase, with Samsung having provided samples to Nvidia. HBM memory stacks are vertically connected to processors, dramatically increasing data transfer speeds essential for AI computing. SK Hynix is currently the dominant supplier of HBM3 chips to Nvidia.