TSMC Said to Raise Foundry Prices 3%-6% From January 2027, Pressuring Apple's iPhone Costs

TSMC (TSM-US) will raise wafer out prices by 3% to 6% starting January 2027, with steeper increases for advanced nodes, according to supply chain sources cited by DigiTimes. The reported move threatens to lift chip procurement costs for Apple (AAPL-US), its largest advanced-node customer. The higher increases apply to 2nm and 3nm processes, where capacity remains short of demand, along with advanced packaging such as CoWoS. Mature and specialty nodes will be negotiated individually based on product, utilization and customer terms. TSMC declined to comment on market rumors. Memory costs are also rising. Apple has accepted Samsung Electronics' Q1 2027 memory pricing of nearly $2 per Gb for DRAM and about $0.33 for NAND, up roughly 30% to 40% from Q3 2026 levels, supply chain sources said last week. Apple already raised iPhone 18 Pro entry prices this year, adding $100 in the US to $1,199 and $1,299. Apple fell 0.80% to $337.02; TSMC ADR dropped 1.20% to $446.57.