SK Hynix Plans to Double Wafer Capacity by 2031 Amid AI Boom, Chairman Says

SK Hynix plans to double its wafer capacity by 2031, group Chairman Chey Tae-won said at the Computex conference in Taipei on Tuesday, June 2, 2026, as the memory chip maker capitalizes on sustained AI-driven demand. Chey, who earlier warned of a global chip shortage persisting until 2030, also said the company needs more partnerships in Taiwan beyond TSMC. He expressed hope that SK Hynix would become a major supplier of high-bandwidth memory (HBM) chips for Nvidia’s Vera Rubin system. As Nvidia’s leading HBM provider, SK Hynix held a 58% global market share in the first quarter, followed by Samsung and Micron at 21% each, according to Counterpoint Research. Goldman Sachs raised its 2028 operating profit forecasts for SK Hynix and Samsung by 24% and 23.3%, respectively, to 454 trillion won and 610 trillion won, citing sustained AI demand. Last week, SK Hynix’s market value surpassed $1 trillion for the first time, joining rivals in an AI-driven rally.