Intel, 3DGS Commit $3.3 Billion to Build Glass Substrate Plant in India

On May 31, 2026, the Indian government announced Intel Corp. (INTC) and U.S. firm 3D Glass Solutions will invest $3.3 billion to build a semiconductor substrate plant in Odisha. The factory, slated to take five to six years, will make glass substrates for advanced packaging, supported by hefty subsidies and creating over 1,800 jobs. The Odisha plant targets an annual capacity of 50 million glass-based 3D packaging units. The move intensifies the race to commercialize glass substrates for AI and HPC. Intel also plans to turn its Rio Rancho, New Mexico, site into the first volume glass substrate factory, adding to a pilot line in Chandler, Arizona, and has placed orders worth trillions of won for materials. Rivals are advancing: TSMC (2330) aims to start its CoPoS pilot line this year with volume output by end-2028, potentially for Nvidia (NVDA); Samsung Electro-Mechanics targets 2027. SEMI sees glass substrate market growth at a 67.2% CAGR from 2028 to 2040.