Intel, 3DGS to Invest $3.3 Billion in India Substrate Plant

Intel Corp. (INTC) and 3DGS Inc. will invest $3.3 billion to build a semiconductor substrate manufacturing facility in India's Odisha state, the Indian government said on May 29, 2026. The move taps into New Delhi's multibillion-dollar subsidy drive to attract chip-related manufacturing under Prime Minister Narendra Modi's local production push. The plant, planned for the Bhubaneswar-Khurda region over five to six years, will focus on advanced packaging glass core substrates and high-density interconnect substrates. It is expected to generate more than 1,800 direct high-skilled jobs. The investment expands Intel's advanced packaging supply chain as global demand for sophisticated chip substrates rises.