Intel (INTC) CEO Outlines 10x Return Goal, Focuses on Advanced Packaging, New Materials

Intel (INTC) CEO Chen Liwu recently outlined a 5-10 year technology roadmap aiming for a 10x shareholder return, emphasizing advanced packaging and new materials to overcome process scaling challenges. The strategy, revealed during a tech podcast interview, focuses on system-level innovation to re-establish competitive advantage in the AI era. Intel is advancing its EMIB (Embedded Multi-die Interconnect Bridge) solution, ensuring mass production yield, with advanced packaging manufacturing partnerships in India and New Mexico. The company is investing in compound semiconductors like Gallium Nitride (GaN), Silicon Carbide (SiC), and Indium Phosphide (InP), alongside glass substrates (via 3DGS) and synthetic diamond thermal wafers (via Diamond Foundry). Intel anticipates its foundry business will show substantial potential between 2030 and 2032, building on foundational yield improvements. The company holds approximately 1,000 module-related patents, actively addressing substrate and module integration challenges.