MediaTek Endorses Both TSMC and Intel Chip Packaging for AI Custom Silicon

MediaTek confirmed on May 29, 2026, that it supports both TSMC’s CoWoS and Intel’s EMIB advanced packaging technologies, giving customers flexibility in custom silicon designs. The move intensifies competition in the artificial intelligence chip sector. The Taiwan-based chip designer doubled its 2026 data center revenue forecast to $2 billion, driven by AI demand. It projects the total addressable market for custom AI ASICs will reach $70 billion to $80 billion in 2027, targeting a 10% to 15% market share. The company is expanding beyond its traditional mobile chip operations. MediaTek disclosed it has multiple test chips on TSMC’s A14 process, the foundry’s next-generation technology slated for volume production in 2028. It also plans to use TSMC’s Arizona fabs for 4-nanometer and 3-nanometer manufacturing. Intel’s EMIB technology is being considered for AI chips MediaTek is designing for Google, according to sources, though the company did not comment on client specifics.