Nvidia Evaluates Glass Substrates for Next-Gen GPUs, Targets 2028 Adoption with TSMC, Corning

Nvidia (NVDA) is evaluating glass substrates for next-generation AI chip packaging, targeting adoption by 2028, according to reports from Seoul Economic Daily and KIPOST. The company has asked South Korean, Japanese and Taiwanese substrate makers to complete development within two years. SCHMID, a German equipment maker, said it is developing glass substrate tools with core suppliers in the Intel (INTC), Nvidia and AMD (AMD) supply chains. SCHMID strategy chief Roland Rettenmaier said through-glass via metallization remains a technical hurdle and customer certification is incomplete. Nvidia CEO Jensen Huang previously met SK Group Chairman Chey Tae-won to discuss next-generation semiconductor cooperation. Nvidia also is pushing TSMC (2330-TW) to develop glass substrate technology. In May 2026, Nvidia agreed to invest up to $2.7 billion in Corning (GLW) with warrants; Corning will build three US plants, expanding optical connectivity capacity tenfold for hyperscale AI data centers. Glass substrates, which replace organic substrates, offer roughly 40% faster chip speeds and about half the power consumption, with low thermal expansion and reduced signal loss.