TSMC (TSM) Shares Hit Record Highs as CoPoS Equipment Arrives for Trial Production

Taiwan Semiconductor Manufacturing Co. (TSM) shares surged to a new high of NT$2,510 on June 22, 2026, pushing its market capitalization past NT$65.09 trillion. This rally follows the delivery of CoPoS technology equipment to its Longtan plant in June 2026 for trial production. TSMC is developing CoPoS technology, primarily sized at 310x310, with industry consensus targeting mass production by 2028 to maintain its leadership in advanced packaging. Research firm TrendForce anticipates key equipment and material validation for CoPoS in 2026, with trial production in 2027 and formal mass production in the second half of 2028. The company's next focus is glass core substrates, expected for mass production after 2030.