Intel Nears 14A Process Milestone With PDK 0.9 Release, Targeting 2028 High-Volume Production

Intel (INTC) said its next-generation 14A advanced process node is progressing, with version 0.9 of its Process Design Kit (PDK) set to launch soon and version 1.0 expected early next year, CEO Lip-Bu Tan said at a semiconductor industry event. Intel aims for high-volume manufacturing on 14A in 2028. The PDK — which contains transistor models and design rules that let chip designers build products for a specific process — currently stands at version 0.5. Tan earlier targeted October availability of PDK 0.9 to external customers. Intel has said 14A will enter risk production in the second half of 2027. Compared with 18A, 14A offers 15% to 20% higher performance at the same power, or 25% to 35% lower power at the same performance, with up to 30% greater die density, according to Intel. The node upgrades to RibbonFET 2 and PowerDirect and introduces High-NA EUV lithography. Intel said in January two potential customers were evaluating 14A test chips, with supplier decisions expected between the second half of 2026 and the first half of 2027. Tan also said he discussed potential collaboration with AMD (AMD) CEO Lisa Su, without disclosing specifics.